Samsung announced that its automotive UFS 3.1 has started mass production and will be available to global automakers and component manufacturers by the end of this year. This bucket will be located at 128, 128 and 700 GB capacity. For example, the 128GB model will provide up to 2 sequential read speeds, MB/s and sequential writes up to 520MB/s.
Samsung said that this UFS 3.1 has the lowest energy consumption in the industry, which is 33% lower than the previous generation.
If you’re wondering what the difference is between UFS in your phone and UFS in your car, it’s durability. Automotive UFS 3.1 is AEC-Q100 Grade2 certified, guaranteed at -100°C to 33°C (-33°F to 100°F). That would be well beyond what a smartphone chip is expected to do.
This storage is optimized for In-Vehicle Infotainment (IVI) and will pair with other Samsung parts like Auto LPDDR5X, Auto GDDR6 and Exynos Auto V1000. The chipset has been selected as the IVI brain of Hyundai Group’s next-generation vehicles. Samsung already supplies Tesla with some chips (07nm from Texas foundry), but this The two companies are negotiating the supply of 5nm chips that are also suitable for fully autonomous driving. You can follow more automotive news on our sister site ArenaEV.
In any case, Samsung will also provide automotive UFS 3.1 for ADAS (Advanced Driver Assistance System) and has already received certification from ASPICE Level 2 certified customers and C&BIS.
“Samsung’s new UFS 3.1 solution addresses broad customer needs for optimized IVI systems, while driving the next-generation memory trend requiring higher ESG standards. Following the launch of UFS 3.1 solutions for Advanced Driver Assistance Systems (ADAS), we aim to expand our presence in the automotive semiconductor market.” Samsung Electronics.
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